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  • Common problems and exclusion methods of hard chromium plating
  • 2021/11/23
  • Hardchromiumplatingithasdevelopedfromordinarynickelplating(darknickel)tofullbrightnickelplating,nickelplatingforluminanthasalsodevelopedfrominorganicluminanttothefourthgenerationoforganicluminant.Thefullybrightnickelplatingtankliquidcurrentlyusedintheelectroplatingindustryisbasicallythewatttype,anditsformulaandprocessspecifications,exceptfortheconcentratedbrightagent,arebasicallythesame.Whenthehardchromiumplatingfails,theprocessexecutionshouldbechecked,analyzethecauseofthefailure,andsolveit. Causeandtroubleshootingmethod 1.Theimbalanceofprocess,lackofcoatingbrightnessandcauses: (1)Theluminantistoolittle,themainsaltcontentistoolow,theanodeplateistooshortandtoolittle,thenickeliondepositionspeedandmigrationspeedcannotreachthebalance,resultingintheinsufficientbrightnessofthecoating. (2)ThepHandthetemperaturearetoohigh.Atthistime,themainsaltiseasilyhydrolyzedintoNi(OH)2precipitation,andpartofNi(OH)2ismixedinthecoating,resultingininsufficientbrightnessofthecoating. (3)Partsarenotwashedafteracidiccopperplating.Atthistime,thereisanalkalinefilmonthepartsurface(copperlayer),andthenickelisdepositedonthefilmlayer,sothatthecoatingcannotreachthemirrorlight. 2.Exclusionmethod (1)Supplementthemainlightagent,andaccordingly.Adjustthemainsaltandothercompositionaccordingtotheprocessrequirementstoincreasetheanodenickelplate. (2)AdjustthepHwithdilutesulfuricacidtoreducethetemperaturetotheprocessspecification. (3)Thepartsshouldbethoroughlywashedafteracidiccopperplating,andthinsulfuricacidcanbeusedifnecessary.​ Tongtonelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult! ​​​​​​    
  • Characteristics and selection of electroplating power supply
  • 2021/10/26
  • Characteristicsandselectionofelectroplatingpowersupply ElectroplatingpowersupplyisaDCdevicethattransformsworkingfrequencyACpowerintodifferentvoltages,frequenciesandwaveforms."Rectification"technologyismainlyappliedinthethyristorrectifier,andboth"rectifying"technologyand"inverter"technologyareappliedinthehigh-frequencyswitchingpowersupply.Electroplatingpowersupplyismainlycomposedofthemainandcontrolcircuits. Electroplatingpowersupplyhasthecharacteristicsofsmallvolume,lightweight,goodenergysavingeffect,highoutputstability,easyoutputwaveform.Itissuitableforgalvanizing,chromeplating,cadmiumplatingandothernonferrousmetals,goldplating,silverplatingandotherpreciousmetals.Then,therearethreerequirementsforchoosingelectroplatingpowersupply:first,tomeettherequiredspecifications,includingthepowersize,waveformindex,currentandvoltagevalueadjustablerange;second,thereliabilityofthepowersupplyitself,whichmainlyreferstotherationalityofthestructure,safety,linecharacteristics,coolingmode;third,thecostperformanceofthepriceshouldbeconsidered. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!
  • Note for the use of pulsed electroplating power supply
  • 2021/10/26
  • Notefortheuseofpulsedelectroplatingpowersupply Pulseelectroplatingpowersupplyhasthefollowingprecautionsduringuse: TheintervalbetweenthepulseplatingpowersupplyandtheplatingtankInordertoensurethatthepulsecurrentwaveformisintroducedintotheplatingtank,itisexpectedthatthedistancebetweenthepulseplatingpowersupplyandtheplatingtankis2-3m,otherwisetherearedgeofthecurrent(descentline)ofthepulsecurrentwaveformisgreater,andtheplatingwillnotreachthedesiredeffect.Second,Yin,anodewireconnectionmethodofDCpowerwireconnectionmethod,notsuitableforthepulsepowerconnection,theoutputofpulseelectroplatingpowerconnection,expectthepolecapacitancebetweenthetwowirescanoffsetthewiretransmissioninductanceeffect,sothebestwaytoYin,anodewireisdoublepair,leadtothetroughedge,andthenadheretothepulsewaveformunchanged.1.Becauseitisapulsepowersupply,inordertoavoidthetransitioneffect,multiplecorewireshouldbeselectedastheconnectionlineofthepulsepowersupplytotheplatingtrough,andmultiplecorewireistwisted,andthelinecapacitancecapacitorcanoffsettheinductanceeffect.2.Thestandardofthewiremustbesatisfiedwiththeratedcurrentpassedthrough.Sincethecurrentdensityofthepulsecurrentismuchlargerthanthatoftheuniformcurrent,itisnecessarytoconsiderthecurrentthermaleffectofthecurrentthatcanacceptthepulsepowersupplytoensuretheminimumattenuationofthepulsepowersupplytotheplatingtrough.Forexample:pulsecurrentis1000A,dutycycleis60%,obviousuniformcurrentis600A,andratedcurrentis:(100060%)1.3780A,ratedvaluebestselected800Awire. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!  
  • The action principle of the plating additive
  • 2021/10/25
  • Toimprovethequalityofthecoating,avarietyofchemicalsareaddedtotheplatingsolution,collectivelyknownasplatingadditives.Sowhatistheactionprincipleofelectroplatingadditives?1.Theworkingprincipleofelectroplatingadditive:metalelectrodepositionprocessisstepbystep:first,theelectroactivematerialparticlesmigratetotheexternalHemholtzlayernearthecathode,electricaladsorption,andthen,thecathodechargeistransferredtotheelectrodeadsorbedpartofthedesolvationionsorsimpleions,formadsorptionatoms,finally,adsorptionatomsmigrateontheelectrodesurface,untilincorporatedintothelattice.Thefirstprocessmentionedaboveallproducesacertainoverpotential(migrationoverpotential,activationoverpotential,andelectriccrystallizationoverpotential,respectively).Onlyatacertainoverpotential,theelectrodepositionprocessofthemetalhasahighenoughgrainnucleationrate,amoderatechargemigrationrateandahighenoughcrystaloverpotentialtoensurethesmoothanddenselusterandfirmbindingwiththesubstratematerial.Theappropriateelectroplatingadditivescanimprovetheoverpotentialofthemetalelectricdepositionandprovideastrongguaranteeforthecoatingquality.2.Diffusioncontrolmechanism:Inmostcases,thediffusionofadditivestothecathode(ratherthanthediffusionofmetalions)determinestheelectrodepositionrateofthemetal.Thisisbecausetheconcentrationofthemetalionsisgenerally100~105timesthatoftheadditiveconcentration,andthecurrentdensityoftheelectrodereactionismuchlowerthanitslimitcurrentdensity.Underthecaseofadditivediffusioncontrol,mostadditiveparticlesdiffuseandadsorbtotheprotrusions,activesitesandspecialcrystalsurfaceswithlargeelectrodesurfacetension,causingtheelectrodesurfaceadsorptionatomstomigratetotheelectrodesurfacedepressionandenterthelattice,thusplayingalevelingandbrighteffect.3.Non-diffusioncontrolmechanism:Accordingtothedominantnon-diffusionfactorsinelectroplating,thenon-diffusioncontrolmechanismofadditivescanbedividedintoelectricadsorptionmechanism,complexgenerationmechanism(includingionbridgemechanism),ionpairmechanism,changingtheHemholtzpotentialmechanism,changingtheelectrodesurfacetensionmechanism,etc. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!
  • Electroplating wastewater treatment process
  • 2021/10/25
  • Ingeneral,thetreatmenttechnologyofelectroplatingwastewatercanbedividedintofourcategories,namely,chemicalmethod,physicalmethod,physicalandchemicalmethod,andbiochemicalmethod.Atpresent,thechemicalmethodwithrelativelylowcostandrelativelymaturetechnologyismainlyappropriatelysupplementedbyothertreatmentmethods. Thegeneraltreatmentprincipleofelectroplatingwastewaterisdifferentwaterquality,dividedandtreated.Generallydividedintochromium-containingwastewater,cyanide-containingwastewater,heavymetalions-containingcomprehensivewastewater,etc.chromatewastewater.Cr6+intheplatingwastewater,reducedtoCr3+withNa2S2O5andprecipitatedwithhydroxide.Cyanogen-containingalkaliwastewater.CyanideinwastewaterisusuallypresentintheformoffreeCN-,HCNandvariousmetalcomplexes[Zn(CN)4]2-,[Cu(CN)3]-,withfurtheroxidativeandremovalafteradditionofsodiumhypochloriteoxidant.Comprehensivewastewater.Aslongastheheavymetaloff-waterintegratedwastewateradjuststheappropriatepHvalue,itwillgenerateconsiderablehydroxideprecipitation.Solidliquidseparation.Afterthereaction,thewateroutletandtheinletwaterinclinedpipesedimentationtankenablevarioushydroxidetosettlequicklyintheinclinedpipearea.Theupperoverflowwaterisfilteredbythesandfiltertodischargethelowersludgeandbetreatedthroughtheplateframefilterpress. Electroplatingprocessshalladoptvariouspollutionminimizationtechnology,withthecleanproductionprocessasthegoal,andchangetheendtreatmentintothewholeprocesscontrol.Onthepremiseofensuringproductquality,uselow-toxicornontoxicsubstancesasfaraspossible.Atthesametime,theuseofchemicalagentsandtheproductionofsludgeshouldbeminimizedintheprocess,andthepollutionofelectroplatingwastewatercanalsobereducedbyreducingtheconcentrationofplatingliquidandtreatmentliquid.Trytorealizeclosedcircuitcirculation,sothatwatercanberecycledandreduceemissions. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!    
  • Five common fault processing methods for electroplating
  • 2021/10/25
  • Intheprocessofelectroplating,itisinevitabletooccurvariouskindsofdifferentfaults,suchaspoorcoatingbindingforce,brittle,pinholeorburr,generalpointhairflower,burningblackandlowcurrentdensityareaisnotbright. Howtocorrectlyhandlethesefaultsisadifficultproblemforelectroplatingpeople. Althoughtherelevantbooksandmagazineslistthetypesofcommonproblems,causesandprocessingmethods,theactualproductionprocesswillappearinavarietyofdifferentsituations,andwhentroubleshooting,itisnoteasyto"login"accordingtothefaultslistedinthebook. Therefore,whentroubleshootingelectroplatingfaults,thefaultshouldbeeffectivelyanalyzedaccordingtothefaulttypeandtheactualsituation,whichmayachievethe"appropriateremedytothecase",andfinallycorrectlydealwithandeliminatethefault,andreduceunnecessarylosses. 01.Typeandcausesofelectroplatingfailure: Electroplatingpersonneedstounderstandthebasicfaulttypeanditscausesbeforetheanalysisandtreatmentofelectroplatingfaults. *Theusualelectroplatingfaultsare:poorcoatingbindingforce,pinholeorburr,brittle,ubiquitoushair,blackburning,andpoorlowcurrentdensityarea.Below,theseseveralfaultsandtheircausesareintroducedindetail. ①Thecoatinghasapoorbindingstrength.Thepoorbindingforceofthecoatingmaybebecausethesurfactantisnotcleanandstilladheredtothesurfaceofthematrix,theoiloxidationfilmonthematrixmetalisnotremoved,ortheconcentrationofcorrosioninhibitorandcorrosionremovalacidishigh. ②Theplatinghaspinholesorburrs.Thedifferencebetweenthepinholeandtheburris:ifyouwipethefaultwithwetpaper,thepinholefaultsurfaceisnotcoveredwithscrapsofpaper,andtheburrfaultsurfaceisstainedwithscrapsofpaper.Pinholesaremostlyfoundincopperbrightacidandbrightnickelplating,commontofineandirregularpinholes(duetooilandorganicimpurities),conicalpinholes(duetohydrogenanalysis)andmoredifficulttoidentifyirregularpinholes(duetosmalldepressionsofmatrixmetal). ③platingisbrittle.Thefragilityofthecoatingismostlyduetoexcessiveorganicadditivesororganicimpuritiesinthecoatingsolution.Inaddition,platingpollutionbyheavymetalionsorabnormalpHvaluemayalsobethecauseoffragility. ④platingpandothairflowers.Therearethefollowingreasonsforthegeneralpoint:thewaterqualityisbadorthetrivalentchromium,blueandwhitepassivationplatingafterthecleaningisnotclean; *Platingliquidcontainsmoreorganicmatter,suchaschloridegalvanization; *Thealkalineplatingsolutionremainsinthematrixmetalpores.Themainreasonforthehairfloweristhepoorcleaningofthepreviousprocessbeforeplating; Theplatingsolutionisstainedwithimpurities; Surfactant,surfactantandlumintant. ⑤The platingisburntandblack.Suchfaultsmaybebecausethetemperatureisnotwithintheprocessrange,theproportionofadditivesisunbalanced,thecurrentdensityistoolarge,thechromegroovecurrentwaveformisproblematic,andtheconcentrationofthemainsaltintheplatingsolutionistoolow. ⑥The lowcurrentdensityareaisnotbright.Suchfailuremaybecausedbythelongusetimeofthependantorpoorcontact,metalimpuritiesintheplatingpollution,thecurrentdensityisnotwithintheprocessrange,theunbalancedproportionofluminantorthequalityofluminantproblems.   02、Handlingprinciplesandstepsofelectroplatingfailure 1.Principleofelectroplatingfailure ①checkswhethertheprocessoperationconditionsandtheoriginalandauxiliarymaterialscomplywiththeprocessregulations,andinsistsonhandlingaffairsaccordingtothe"chapter". ②shouldprepareallkindsofmaterialsandbackgroundmaterialsinadvance,andmeasurescanbetakenimmediatelyincaseoffailure. ③tothefrontlinetodoacarefulinvestigation,"listeningisfalse,seeingistrue",toavoidtheoccurrenceofindividualpersonneltohidethetruth,shirkresponsibility. 2Handlingstepsforplatingfailure Thefirststepistolistthevariouspossiblesituationsonebyone,carefullyanalyzethemaccordingtotheactualperformancesymptoms,andmakeapreliminaryevaluationofthecauseofthefailure. Inthesecondstep,theself-trialmethodverifiedthevariousreasonsanalyzedandestimatedbythefirststeptograduallyexcludethenon-existingfactors. Forexample,checkequipmentandconductivecontact(includingfittings),watersourceandenvironmentpollution,harmfulimpuritiesinsolution,anode,chemicalrawmaterials;smallgroovetestmodelmainlyanglecathodeandHullgroovetest;job-hoppingtestinmulti-layerelectroplatingtodeterminethefailure. Thethirdstepistodeterminetheactualcauseofthefailureaccordingtothetestresults,andtoconductfurtherverification. Thefourthstep,accordingtotheactualreasonschecked,theappropriatemedicinetothecase,takecorrespondingmeasures.   03.Analysisandtreatmentofelectroplatingfaults 1.Analysisofelectroplatingfailure Electroplatingfaultsareanalyzed,usuallyfromthefollowingfouraspects: ①preplatingtreatment,mainlyincludingelectrolyticoilremoval,chemicaloilremoval,polishing,polishing,polishing,pickling,lighterosion,weakcorrosion,neutralizationandotheraspects,somefactoriesdonotpayattentiontocleaning,inordertomaintaintheconcentrationofneutralizationliquid,mustbeoftentested. ②electroplatingprocess,mainlyincludesequipment,platingfailure,platingcomposition,cleaning,operationimproper,anode,filtrationeffect,conductivecontact,compressedairpurificationandotheraspects. ③post-platingtreatmentoftencausesqualityproblemsduetocleaning,suchastheflowingwaterontheautomaticlineisnotreplacedforalongtime,resultinginuncleancleaningwater.Itshouldbenotedthatitisbestnottostirwithairforthelastcleaning. ④environmentalpollution,theairoftencontainssomedust,smoke,chemicalgasesandchemicalacidfog.   2.Inspectionmethodforelectroplatingfailure Inspectionmethodfor①preplatingtreatment.Carefullychecktheconditionofpre-platingparts.Thesurfaceofthecoatedpartsneedstobeallwetbutnothangingwaterdroplets,norcantherehaveresidualoxidationskin,needtoachieveacompletelycleanstate. Inspectionmethodforthe②equipment.Totreatthependantcontactandconductivityseriously,canusethemethodofsmallelectricbeads. Inspectionmethodofthe③matrixmaterial.Itneedstobecarriedoutinthelaboratory,thepartsarecarefullycleanedwithoilandwaxremover,andthenputtheminthenewlyequippedpretreatmentsolution,thenstricttreatmentaccordingtotheoperatingconditions,andthenputthemintothepurifiedplatingliquidtofurthermakesmalltanktestplating,andthenforidentification.   3.Specificmethodofliquidplatingtreatment Thefollowingsuggestionsforcommonplatingproblems: Treatmentofthedysregulated①components.Inordertokeeptheplatingliquidcompositionwithintheprocessscope,theplatingliquidneedstobeanalyzedregularly,andtomaketheplatingliquidcompositiontimelyadjustmentaccordingtotherelevantanalysisresults. Removeof②metalimpurities:Thefollowingmethodscanbeusedtosolvetheproblemofmetalmagazines: A.Alkalinityprecipitationmethod,forexample,fortrivalentironprecipitation,thepHvalueofnickelplatingcanbeadjustedintheliquid. b.Electrolysismethod,ifusedtoremovecopper,leadandotherimpuritiesinnickelplatingsolution. c.Coordinationprecipitationmethod,suchasnickelplatingliquidcanbeusedusingQTcopper. Thed.Oxidationprecipitationmethod,forexampleinanickelplatingsolutionwantingtogenerateironhydroxideprecipitation,canusehydrogenperoxidetooxidizedivalentirontotrivalentiron. e.Sulfideprecipitationmethod,forexample,wanttogalvanizedliquidintheprecipitationofcopper,leadimpuritiescanusesodiumsulfide,potassiumsulfide. ③organicimpurities.Tosolvesuchproblems,youneedtobedamagedwithoxidant,andthenadsorborganicmatterwithactivatedcarbon. Commonoxidantsarehydrogenperoxide,potassiumpermanganate,bisulfite,etc. Itshouldbenotedthatwhethertheirby-productsshouldhaveanimpactontheplating. Removalofthe④oxidant.Whenchromiumiscontainedinthenickelplatingliquid,itcanbereducedwithinsurancepowder. Thespecifictreatmentstepsare:firstacidifytheplatingliquidtoapHvalueof3withsulfuricacid,thenaddtheinsurancepowder0.02~0.40g/Landstirconstantly,thetemperatureisheatedto60,andtheplatingliquidpHvalueisadjustedto6after1h. Then,itisstaticforseveralhoursbeforefiltering,toremovetheexcessinsurancepowder,theappropriateamountofhydrogenperoxidecanbeaddedtothefilteredplatingsolution;finally,theplatingsolutionpHisadjustedtonormalwithsulfuricacid,andelectrolysisplating. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!    
  • The difference between normal-temperature anodic oxidation and low-temperature aluminum hard anodic oxidation
  • 2021/10/25
  • Normaltemperaturealuminumhardanodioxideisalsocalledordinaryoxidefilmthicknessisgenerally5-15microns,thehardnessof200-400HV. Low-temperatureoxidationisgenerallyusedforhardoxidation,hardoxidationcharacteristics 1:Thecolormembranelayerisgray.brown.Inkgreentoblack,relatedtothematerialcompositionandprocess,andthelowerthetemperature,thethickerthefilmlayer,thedarkerthecolor. 2:Hardnessoxidefilmisextremelyhard,HV=1200-1500hardnessonpurealuminum,reducedhardnessonalloyaluminum.HV=400-800.Withmicrowells. 3:Thethickfilmlayercanreachupto250microns,soalsoknownasthickfilmoxidation. 4:Corrosionhasextremelyhighcorrosionresistance,especiallyintheindustrialatmosphereandmarineclimate. 5:Insulationandadiabaticduralfilmresistance,100microns,canwithstandmorethan2000volt,meltingpointof2050degreesCelsius,thermalconductivityislowto67KW/(M.K),isanexcellentthermalresistancematerial. 6:Thebindingforceandthebodybindingisverystrongandsolid. Duetothepropertiesofaluminumhardanodidicoxidation,itiswidelyused.Itismainlyusedforheatresistance,wearresistanceandhighinsulationperformancerequirementsofaluminumparts,suchaspiston,cylinder,bearing,waterandelectricityequipmentimpeller,etc. YKelectroplatingoxidationpowerseriesofproducts,focusonelectroplating,weunderstandtheelectroplatingtechnology,welcometoconsult!

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